Robust thermal conductivity facilitates the movement of heat-energy at the LED junction to the convective surface. Doing this right means using materials and processing technologies that render minimal thermal resistance, component geometries that encourage the movement, and generous and uninterrupted paths to the convection surface (where the heat-energy is exchanged with the ambient air).
The materials and processing technologies used must combine to minimize thermal resistance. For example, while die casting provides a lighter part, it introduces air (10,000x higher thermal resistance of aluminum), and is a poor processing technology for a heat sink. The extrusion process inherently produces a more dense and much more thermally conductive component.
The thermally inductive substrate serves two purposes. First, this clay-like material compensates for microscopic surface imperfections in both the extrusion and the circuit board. This displaces air to insure a robust thermal interface. Second, this product is developed in layers that spread the heat-energy into a wider path as it conducts into the heat sink. This reduces competition for the same molecules to essentially widen the path to the convective surface.
The copper clad circuit boards, while many times more expensive than traditional circuit boards, serve a similar purpose in widening the thermal pathways. Thermal vias are used to channel the heat-energy away from the LED. Combining this with the most generous real estate (25x25mm LED spacing) in the industry means that heat-energy from each LED has a large and low thermal resistance pathway.
The final link in the conductivity chain is the heat sink itself. The physics in thermodynamics states that heat-energy will inherently seek and want to remain in the thinnest section it can (where it can thrive). The Cireon heat sink design provides a geometry that insures a progressive reduction in thickness, inherently drawing the heat-energy to the very tip of the tapered fins.
click here to download our white paper, Thermal Management in Solid State Lighting